Signal Integrity and power integrity
High-speed circuits and System in package
Numerical methods and CAD techniques

Mar.2003~Sept.2007 Ph.D., Shanghai Jiao Tong University
Sept.1999~Mar.2002 M.S., Tianjin University,
Sept.1995~Jun.1999 B.S., Tianjin University

Mar. 2002～Present associate professor, Dept. of Electronic Engineering, Shanghai Jiao Tong University
Apr. 2008~Apr. 2009 Visiting scholar, School of Electrical and Computer Engineering, Georgia Institute of Technology

My research is in the area of high-speed interconnects, signal integrity, power integrity and EMC.

1.First-class Science and Technology Research Award, by Shanghai municipal government, 2005. (Award number: 2005010003-1-05)
2.Second–class National Technology Invention Award, by the State Council of China, 2008.
(Award number: 2008-F-236-2-03-R05)
3.Excellent Ph.D Dissertation Award, by the Education Committee of Shanghai, 2011.
4.Excellent Ph. D Dissertation nomination award, by the Education Committee of China, 2011.
5.Okawa foundation research grant, by Okawa Research Foundation, 2014.
6.Outstanding Youth Foundation, by National Natural Science Foundation of China, 2016.

2009.09～present Semiconductor and Device Physics , graduated students curriculum
2002.09～present Design of VLSI and Verilog HDL, graduated students curriculum
2002.09～2008.01 Analysis and design of microwave and high-speed integrated circuits, graduated students curriculum

[1] Yan Shao, Xiao-Chun Li, Lin-Sheng Wu, Jun-Fa Mao, “A Wideband Millimeter-Wave Substrate Integrated Coaxial Line (SICL) Array for High-Speed Data Transmission,” IEEE Transactions on Microwave Theory and Techniques, 2017.
[2] Xin Tan, Xiao-Chun Li, Junfa Mao, “Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, No.2, pp.269 - 275, Feb. 2017.
[3] Ning Wang, Xiao-Chun Li, Jun-fa Mao, “Improvement of Thermal Environment by Thermoelectric Coolers and Numerical Optimization of Thermal Performance,” IEEE Transactions on Electron Devices，vol. 62, no.8, pp.2579-2586, Aug. 2015.
[4] Xiao-chun Li, Jun-fa Mao, and Swaminathan Madhavan, “Transient Analysis of CMOS-Gate-Driven RLGC Interconnects Based on FDTD,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 30, no. 4, pp. 574 – 583, Apr. 2011.
[5] Xiao-chun Li, Mao, Jun-Fa, “An area-efficient very large scale integration architecture for modified Euclidean algorithm with dynamic storage technique,” International Journal of Electronics, 96(8), pp 837-842, Jun. 2009.
[6] Xiao-chun Li, Jun-fa Mao, Wen-yan Yin, “Dynamic Power Model of CMOS Gates Driving Transmission Lines Based on Fourier Analysis,” IEEE Transactions on Electron Devices, vol. 55, no. 2, pp.594-560, Feb. 2008.
[7] Xiao-chun Li, Mao Jun-fa, Huang Hui-fen and Liu Ye, “Global Interconnect Width and Spacing Optimization for Latency, Bandwidth and Power Dissipation,” IEEE Transactions on Electron Devices, 2005, vol. 52, no. 10, pp. 2272–2279, Oct. 2005.
[8] Xiao-chun Li and Jun-fa Mao, “Accurate Analysis of Interconnect Trees with Distributed RLC Model and Moment Matching”, IEEE Transactions on Microwave Theory and Techniques, vol. 52, no.9, pp. 2199 – 2206, Sept. 2004.
[9] Min Tang, Jun-Fa Mao and Xiao-chun Li, “Analysis of Interconnects with Frequency-Dependent Parameters by Differential Quadrature Method,” IEEE Microwave and Wireless Components Letters, vol.15, no.12, pp. 877-879, Dec. 2005.
[10] Hui-Fen Huang, Jun-Fa Mao, Xiao-chun Li, andZhengfan Li, “A photonic bandgap microstrip filter based on YBCO superconducting film,” IEEE Transactions on Applied Superconductivity, vol.15, no.3, pp. 3827–3830, Mar. 2005.
[11] Feng Cheng, Junfa Mao, and Xiao-chun Li, “Timing-driven placement based on path topology analysis,” IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, vol. E88, no. 8, pp. 2227–2230, Aug. 2005.
[12] Xiao-chun Li and Junfa Mao, “A New Delay Model for Distributed RLC Trees,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 259–271, Jan. 2006.
[13] Xiao-chun Li and Junfa Mao, “An Area-Efficient Euclid Architecture with Low Latency,” Journal of Active and Passive Electronic Devices, vol. 1 pp. 221–227, Jan. 2006.
[14] Zhen Wei, Xiaochun Li, and Junfa Mao， “An accurate RLGC circuit model for dual tapered TSV structure,” Journal of Semiconductors, vol.35，no.9, pp. 136-142，Sept. 2014.
[15] Xin Tan, Xiaochun Li and Junfa Mao, "A hybrid method for calculating dipole moment model from near-field scanning," 2016 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT), Beijing, China, Jun. 5-8, 2016, pp. 964-966.
[16] Xiao-Jian Ma, Xiao-Chun Li, Ning Wang, Jun-Fa Mao，“Power Integrity Co-analysis and Design in a PCB with BGA Package Using Transmission Matrix Method，”IEEE Electrical Design of Advanced Packaging & Systems 2015, Seoul, Korea,Dec.14-16, 2015, pp.78-80.
[17] Xin Wei, Xiao-chun Li, Ning Wang, Yan Shao, and Jun-fa Mao， “A Wide Band Millimeter-wave Substrate Integrated Coaxial Line (SICL) for High Speed Data Transmission,” Asia-Pacific Microwave Conference 2015, Nanjing, China, Dec.6-9, 2015， pp.1-3.
[18] Pei Yu, Xiaochun Li, Ning Wang, Junfa Mao，“Time Domain Analysis of Non-uniform Transmission Lines Based on WLP-FDTD,”Asia-Pacific Microwave Conference 2014, Sendai, Japan, Nov.4-8, 2014, pp.295-297.
[19] Ji Zhang, Xiaochun Li, Ning Wang, Junfa Mao, “A Super Wideband X-Complementary Split Ring resonator structure for Power Distribution Network,” IEEE Electrical Design of Advanced Packaging & Systems 2014, Bangalore, India, Dec.14-16, 2014, pp. 37-40.
[20] Xi-Wang Yuan, Xiao-Chun Li, Ning Wang, Jun-Fa Mao, “High-Speed Data Transmission Using Half Mode Substrate Integrated Waveguide,” IEEE Electrical Design of Advanced Packaging & Systems , Bangalore, India, Dec.14-16, 2014, pp.105-108.